Silicon 2.5D Packaging Research
Oct 2025 — May 2026
University of Dayton — Dayton, OH
Packaged silicon dies using the Nano Dimension Dragonfly IV PCB 3D Printer. A base dielectric layer was created and the die was glued down onto it. Additional dielectric with vias and silver nanoparticle ink traces were then printed, with traces fanning out from the die pads to test pads.
