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Research experience

Silicon 2.5D Packaging Research Oct 2025 — May 2026
University of Dayton — Dayton, OH

Packaged silicon dies using the Nano Dimension Dragonfly IV PCB 3D Printer. A base dielectric layer was created and the die was glued down onto it. Additional dielectric with vias and silver nanoparticle ink traces were then printed, with traces fanning out from the die pads to test pads.

Microscope image of silver nanoparticle ink traces on dielectric
Close-up of printed vias and trace structures Microscope image of packaged die with silver nanoparticle ink traces
AI Band-gap Energy Prediction Sep 2024 — Dec 2024
University of Dayton — Dayton, OH

Predicted Band-gap Energy of TMDCs by converting euclidean coordinates to canonical coordinates using Python. Used AI algorithms SVR and SVC, with a mean squared error (MSE) of 0.00695 and R-squared value of 0.974.

Histogram of band-gap energies in electron volts 3D plot of first set of coordinates 3D plot of second set of coordinates 3D plot of third set of coordinates Results of support vector classification Results of support vector regression
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