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Resume

Moussa Hamzi

hamzim3@udayton.edu moussa31303@gmail.com linkedin.com/in/moussahamzi
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Qualifications
Computer Architecture, Computer Systems Design, VHDL, RTL Semiconductor Fabrication 2.5D Heterogenous Integration Strong Interpersonal and Communication Skills, Adaptability, and Teamwork and Collaboration
Education
Master of Science, Electrical Engineering 05/2028
University of Dayton, School of Engr. — Dayton, OH
  • Relevant Courses: Computer Design, Contemporary Digital Systems
Bachelor of Electrical Engineering 05/2026
University of Dayton, School of Engr. — Dayton, OH
  • Relevant Courses: Discrete Signals and Systems, PCB Design and Manufacturing, Computer Systems Engineering, Electronic Devices, Intro to Semiconductor Manufacturing, Data Analytics Fundamentals
Certifications 02
Altium Education PCB Design Course 04/2026
Intel Oasis Rapid Certification 05/2025
Projects 03
GPU Core 09/2026
University of Dayton — Dayton, OH
  • Designed a 128-lane SIMD GPU execution core in VHDL with 16 execution units and 4 independent schedulers
  • Implemented round-robin scheduling, dependency tracking, and register writeback
  • Built independent program sequencing and register storage for multiple resident groups per SIMD engine
Vision Walker System 10/2025 — 05/2026
University of Dayton — Dayton, OH
  • Led senior design team in building a real-time assistive navigation system for blind and deaf individuals
  • Built on Jetson Orin Nano, uses stereo cameras and a time-of-flight sensor for 3D spatial awareness
Pipelined MIPS Simulator 09/2025 — 11/2025
University of Dayton — Dayton, OH
  • Converted an unpipelined MIPS processor simulator written in C into a 5-stage pipelined simulator
  • Implemented core pipeline behavior incl. data forwarding, stalling, branch/jump handling, and write-back
Research Experience 03
Memristor Crossbar Application 10/2025 — Present
University of Dayton — Dayton, OH
  • Construction of a 4x4 Memristor Crossbar using Knowm Memristors through breadboarding
  • Collecting measurement data and comparing performance, efficiency, with SPICE simulations
  • Crossbar completes mathematical operations in analog and stores data digitally
Silicon 2.5D Packaging Research 10/2025 — 05/2026
University of Dayton — Dayton, OH
  • Packaged silicon dies using Nano Dimension Dragonfly IV PCB 3D Printer
  • Created dielectric package, with die glued into the base, and vias, silver ink traces and test pads printed above
AI Band-gap Energy Prediction 09/2024 — 12/2024
University of Dayton — Dayton, OH
  • Predicted Band-gap Energy of TMDC’s by converting Euclidean coordinates to canonical coordinates using Python
  • Used AI algorithms SVR and SVC, with a mean squared error (MSE) of 0.00695 and R-squared value of 0.974
Experience 02
Teaching Assistant 09/2026 — Present
School of Engr., ECE Department, UD — Dayton, OH
  • Instructing Digital Systems Lab classes, teaching students how to implement basic digital circuits on FPGA boards
Engineering Lab Assistant 05/2024 — Present
School of Engr., Lab Management Office, UD — Dayton, OH
  • Support lab management team in daily needs, using technological and non-technological solutions
  • Created student training records management and sign in app for University’s Makerspace
  • Troubleshooted oscilloscopes, power supplies, multimeters, and function generators
  • Trained over 50 high school students in soldering during single day events
Index 04
i. Hardware Projects
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ii. Research
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iii. Software Projects
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iv. Resume
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